Sika's new Foam Adhesive is ideal for bonding low density modelling boards such as M80, M160 and M300.

The adhesives fine cellular foam structure has similar characteristics to the lightweight board. This gives you a practically invisible joint line when machined.

The Foam adhesive is one component system making it easy to use and it's fast curing enables you to start machining after just 6 hours.

For other board bonding solutions please click here (link to flyer for fast adhesive & power adhesive)

To order or for more information, see our Products section or contact John Burn for up-to-date information on the full range of John Burn products.